{"id":46597,"date":"2025-09-03T23:54:21","date_gmt":"2025-09-03T16:54:21","guid":{"rendered":"https:\/\/hbbgroup.net\/japans-resonac-sets-up-consortium-on-next-gen-chip-packaging-tech\/"},"modified":"2025-09-03T23:54:21","modified_gmt":"2025-09-03T16:54:21","slug":"japans-resonac-sets-up-consortium-on-next-gen-chip-packaging-tech","status":"publish","type":"post","link":"https:\/\/hbbgroup.net\/zh\/japans-resonac-sets-up-consortium-on-next-gen-chip-packaging-tech\/","title":{"rendered":"Japan&#8217;s Resonac sets up consortium on next-gen chip packaging tech"},"content":{"rendered":"<div>\n<p><span><a href=\"http:\/\/asia.nikkei.com\/business\/technology\" data-trackable=\"primary-tag\" data-dark-mode=\"false\">Technology<\/a><\/span><\/p>\n<p data-trackable=\"subhead\" data-dark-mode=\"false\">Move comes as AI drives demand for ever-greater computing power<\/p>\n<\/div>\n<div>\n<p><img decoding=\"async\" src=\"https:\/\/www.ft.com\/__origami\/service\/image\/v2\/images\/raw\/https%3A%2F%2Fcms-image-bucket-productionv3-ap-northeast-1-a7d2.s3.ap-northeast-1.amazonaws.com%2Fimages%2F0%2F3%2F3%2F3%2F11433330-1-eng-GB%2F637cb5a79154-NY2_3272.JPG?width=780&#038;fit=cover&#038;gravity=faces&#038;dpr=2&#038;quality=medium&#038;source=nar-cms&#038;format=auto\" alt=\"20250903 Semiconductor Japan\" width=\"780\" height=\"auto\" loading=\"eager\"><\/p>\n<p data-trackable=\"caption\" data-dark-mode=\"false\">Chip packaging, where multiple chips are integrated into a single module, is becoming increasingly important for boosting computing power. (Photo by Yuki Nakao)\u00a0<\/p>\n<div>\n<p>SHOTARO TANI<\/p>\n<div data-dark-mode=\"false\">\n<p><span>September 3, 2025 18:35 JST<\/span><\/p>\n<\/div>\n<\/div>\n<div id=\"article-body-preview\" data-article-body data-trackable=\"bodytext\" data-atlas=\"body\">\n<p data-dark-mode=\"false\">TOKYO &#8212; Japanese semiconductor material maker Resonac has established a consortium of nearly 30 global companies to develop advanced chip packaging technologies, as the industry looks for cost-effective ways to boost chip performance to meet surging AI demand.<\/p>\n<\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>Technology Move comes as AI drives demand for ever-greater computing power Chip packaging, where multiple chips are integrated into a [&hellip;]<\/p>","protected":false},"author":1,"featured_media":46598,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[95],"tags":[],"class_list":["post-46597","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-tin-tuc-the-gioi-vi"],"acf":[],"_links":{"self":[{"href":"https:\/\/hbbgroup.net\/zh\/wp-json\/wp\/v2\/posts\/46597","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/hbbgroup.net\/zh\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/hbbgroup.net\/zh\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/hbbgroup.net\/zh\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/hbbgroup.net\/zh\/wp-json\/wp\/v2\/comments?post=46597"}],"version-history":[{"count":0,"href":"https:\/\/hbbgroup.net\/zh\/wp-json\/wp\/v2\/posts\/46597\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/hbbgroup.net\/zh\/wp-json\/wp\/v2\/media\/46598"}],"wp:attachment":[{"href":"https:\/\/hbbgroup.net\/zh\/wp-json\/wp\/v2\/media?parent=46597"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/hbbgroup.net\/zh\/wp-json\/wp\/v2\/categories?post=46597"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/hbbgroup.net\/zh\/wp-json\/wp\/v2\/tags?post=46597"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}