TOKYO — Japanese semiconductor material maker Resonac has established a consortium of nearly 30 global companies to develop advanced chip packaging technologies, as the industry looks for cost-effective ways to boost chip performance to meet surging AI demand.
Move comes as AI drives demand for ever-greater computing power
Chip packaging, where multiple chips are integrated into a single module, is becoming increasingly important for boosting computing power. (Photo by Yuki Nakao)
SHOTARO TANI
September 3, 2025 18:35 JST
